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AMD Intros EPYC 97x4 “Bergamo” CPUs: 128 Zen 4c CPU Cores For Servers, Shipping Now

AMD Intros EPYC 97×4 “Bergamo” CPUs: 128 Zen 4c CPU Cores For Servers, Shipping Now

Kicking off a busy day of product announcements and updates for AMD’s data center business group, this morning AMD is finally announcing their long-awaited high density “Bergamo” server CPUs. Based on AMD’s density-optimized Zen 4c architecture, the new EPYC 97×4 chips offer up to 128 CPU cores, 32 more cores than AMD’s current-generation flagship EPYC […]

AMD Data Center and AI Technology Premiere Live Blog (Starts at 10am PT/17:00 UTC)

AMD this morning is hosting their first data center and server-focused event in quite some time. Dubbed the “AMD Data Center and AI Technology Premiere,” we’re expecting a sizable number of announcements from AMD around their server and AI product portfolio. Highlighting this should be fresh news on AMD’s forthcoming MI300 accelerator, the […]

Microsoft to Bring Game Pass Games to NVIDIA's GeForce Now

Microsoft to Bring Game Pass Games to NVIDIA's GeForce Now

Microsoft on Sunday announced plans to bring select PC Game Pass games to NVIDIA’s GeForce Now cloud streaming service later in 2023. The move will allow gamers to enjoy Microsoft’s curated collection of PC games on high-end hardware in the cloud without purchasing either the games or a high-end gaming device (PC, Xbox), all for […]

Western Digital Estimates HAMR HDDs to Emerge in 1.5 Years

Western Digital Estimates HAMR HDDs to Emerge in 1.5 Years

Western Digital is somewhat behind its rival Seagate in adopting heat-assisted magnetic recording (HAMR), which promises radical improvements to areal density and HDD capacities. Still, the company expects hard drives that use this recording method to enter mass production in the next 1.5 years. This technology will open doors for nearline drives offering 40 TB […]

TSMC Opens Advanced Backend Packaging Fab for AI and HPC Products

TSMC Opens Advanced Backend Packaging Fab for AI and HPC Products

TSMC on Friday formally opened its Advanced Backend Fab 6 facility, which it will be using to expand the company’s capacity for building high-end, multi-chiplet products. The facility is said to be the first all-in-one automated fab offering 3DFabric integration of front-end to back-end process and testing services. TSMC’s Advanced Backend Fab 6 can process about one million 300-mm […]