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Micron Cancels Ballistix TX3 NVMe SSD

Micron Cancels Ballistix TX3 NVMe SSD

At Computex in June, Micron announced that Crucial’s Ballistix brand was being promoted to a standalone brand for gaming-oriented products. Their exhibit included three tiers of Ballistix DRAM products and one SSD: the Ballistix TX3 M.2 PCIe SSD. Based on Micron 3D MLC NAND and the Silicon Motion SM2260 NVMe SSD controller, the TX3 was to be Micron’s first consumer/retail SSD with 3D MLC or a PCIe interface and was slated for a release sometime in the second half of 2016.

Micron has informed us this week that the Ballistix TX3 program has been canceled. This leaves Micron’s consumer SSD strategy up in the air. With the release this summer of the Crucial MX300, Micron moved their mainstream SATA MX line from MLC to 3D TLC NAND, casting doubt on the future of the value-oriented BX series and implying that their 3D MLC might be regarded as premium enough to be reserved for PCIe SSD. With the Ballistix TX3 canceled, we no longer have any clear indication of how Micron plans to move forward with their consumer SSD products.

Micron may have decided to switch SSD controllers. While Silicon Motion reported last week at Flash Memory Summit that final firmware for the SM2260 controller is ready, Phison’s E7 controller is also available and ready to roll out, and Micron has been shipping Marvell’s 88SS1093 NVMe controller on their 7100 series enterprise SSDs in both U.2 and M.2 form factors, albeit with planar MLC NAND rather than their 3D NAND. Micron may also have decided that the timing was wrong to be getting into a market segment that Samsung has been handily dominating; beating Samsung’s PCIe M.2 drives on performance will be an uphill battle to say the least, and substantially undercutting them on price may not be possible while Micron is still ramping up production of their 3D MLC NAND.

Micron’s OEM and enterprise offerings may offer some clues to their plans, but the Micron and Crucial SSD product lines are no longer mere alter egos of each other. Micron’s 1100 series SATA SSD is the nearest equivalent to the MX300 with the same controller and same 3D TLC NAND, but the 1100 is more a little more conservative by retaining the traditional power of two drive capacities with generous overprovisioning while the MX300 dedicates some of the extra capacity of Micron’s 3D TLC chips to increasing the usable drive capacity.

Micron announced a 2100 series at the same time as the 1100 series, but did not provide full details as it was scheduled for a later introduction than the 1100, but still by the end of summer this year. The photos provided of the 2100 clearly showed the Silicon Motion SM2260 controller and the drive was stated to be using 3D NAND, but whether it would be MLC or TLC was not specified. The layout of the 2100 M.2 card was different than that of the Ballistix TX3 prototypes shown at Computex, but they still clearly had a few things in common. Micron’s website still lists the 2100 as “Coming Summer 2016”, and with regards to its fate Micron had this statement for us:

Micron is committed to delivering client PCIe NVMe solutions. While we are excited by the possibilities with our OEM partners, we are not disclosing availability details at this time. We will be sure to keep you updated as we are ready to share more.

We are eager to hear what Micron decides to do, as they are still only the second manufacturer to deliver 3D NAND for the client and consumer SSD market and we have not yet had the chance to test their 3D MLC NAND. Competition in the consumer PCIe SSD space will be heating up with or without Micron’s participation as more drives based on Phison, Marvell and Silicon Motion PCIe NVMe controllers hit the market over the next few months, but Micron’s entry was particularly promising for the inclusion of 3D NAND.

More Details on Broxton: Quad Core, ECC, Up to 18 EUs of Gen9

More Details on Broxton: Quad Core, ECC, Up to 18 EUs of Gen9

An interesting talk regarding the IoT aspects of Intel’s Next Generation Atom Core, Goldmont, and the Broxton SoCs for the market offered a good chunk of information regarding the implementations of the Broxton-M platform. Users may remember the…

Micron Cancels Ballistix TX3 NVMe SSD

Micron Cancels Ballistix TX3 NVMe SSD

At Computex in June, Micron announced that Crucial’s Ballistix brand was being promoted to a standalone brand for gaming-oriented products. Their exhibit included three tiers of Ballistix DRAM products and one SSD: the Ballistix TX3 M.2 PCIe SSD. Based on Micron 3D MLC NAND and the Silicon Motion SM2260 NVMe SSD controller, the TX3 was to be Micron’s first consumer/retail SSD with 3D MLC or a PCIe interface and was slated for a release sometime in the second half of 2016.

Micron has informed us this week that the Ballistix TX3 program has been canceled. This leaves Micron’s consumer SSD strategy up in the air. With the release this summer of the Crucial MX300, Micron moved their mainstream SATA MX line from MLC to 3D TLC NAND, casting doubt on the future of the value-oriented BX series and implying that their 3D MLC might be regarded as premium enough to be reserved for PCIe SSD. With the Ballistix TX3 canceled, we no longer have any clear indication of how Micron plans to move forward with their consumer SSD products.

Micron may have decided to switch SSD controllers. While Silicon Motion reported last week at Flash Memory Summit that final firmware for the SM2260 controller is ready, Phison’s E7 controller is also available and ready to roll out, and Micron has been shipping Marvell’s 88SS1093 NVMe controller on their 7100 series enterprise SSDs in both U.2 and M.2 form factors, albeit with planar MLC NAND rather than their 3D NAND. Micron may also have decided that the timing was wrong to be getting into a market segment that Samsung has been handily dominating; beating Samsung’s PCIe M.2 drives on performance will be an uphill battle to say the least, and substantially undercutting them on price may not be possible while Micron is still ramping up production of their 3D MLC NAND.

Micron’s OEM and enterprise offerings may offer some clues to their plans, but the Micron and Crucial SSD product lines are no longer mere alter egos of each other. Micron’s 1100 series SATA SSD is the nearest equivalent to the MX300 with the same controller and same 3D TLC NAND, but the 1100 is more a little more conservative by retaining the traditional power of two drive capacities with generous overprovisioning while the MX300 dedicates some of the extra capacity of Micron’s 3D TLC chips to increasing the usable drive capacity.

Micron announced a 2100 series at the same time as the 1100 series, but did not provide full details as it was scheduled for a later introduction than the 1100, but still by the end of summer this year. The photos provided of the 2100 clearly showed the Silicon Motion SM2260 controller and the drive was stated to be using 3D NAND, but whether it would be MLC or TLC was not specified. The layout of the 2100 M.2 card was different than that of the Ballistix TX3 prototypes shown at Computex, but they still clearly had a few things in common. Micron’s website still lists the 2100 as “Coming Summer 2016”, and with regards to its fate Micron had this statement for us:

Micron is committed to delivering client PCIe NVMe solutions. While we are excited by the possibilities with our OEM partners, we are not disclosing availability details at this time. We will be sure to keep you updated as we are ready to share more.

We are eager to hear what Micron decides to do, as they are still only the second manufacturer to deliver 3D NAND for the client and consumer SSD market and we have not yet had the chance to test their 3D MLC NAND. Competition in the consumer PCIe SSD space will be heating up with or without Micron’s participation as more drives based on Phison, Marvell and Silicon Motion PCIe NVMe controllers hit the market over the next few months, but Micron’s entry was particularly promising for the inclusion of 3D NAND.

More Details on Broxton: Quad Core, ECC, Up to 18 EUs of Gen9

More Details on Broxton: Quad Core, ECC, Up to 18 EUs of Gen9

An interesting talk regarding the IoT aspects of Intel’s Next Generation Atom Core, Goldmont, and the Broxton SoCs for the market offered a good chunk of information regarding the implementations of the Broxton-M platform. Users may remember the…

Marvell Announces NVMe Controller for DRAM-Less PCIe 3.0 x2 SSDs

Marvell Announces NVMe Controller for DRAM-Less PCIe 3.0 x2 SSDs

Marvell has announced its new controller for affordable and miniature SSDs, the 88NV1160. The chip can be used to build small form-factor SSDs in M.2 as well as BGA packages. The 88NV1160 supports all modern and upcoming types of NAND flash, LDPC error correction, NVMe protocol and other advantages of modern SSD controllers, but it does not require external DRAM buffers so to reduce BOM costs of upcoming SSDs.

The Marvell 88NV1160 is a quad-channel controller that supports PCIe 3.0 x2 interface, NVMe 1.3 protocol (in addition to AHCI) as well as various types of NAND flash memory, including 15 nm TLC, 3D TLC as well as 3D QLC with ONFI 3.0 interface with up to 400 MT/s transfer rates. The 88NV1160 controller is powered by dual-core ARM Cortex-R5 CPUs along with embedded SRAM with hardware accelerators to optimize IOPS performance. The chip supports Marvell’s third-generation LDPC error correction technology (which the company calls NANDEdge ECC) in a bid to enable high endurance of drives featuring ultra-thin TLC or 3D QLC memory.

Specifications of Marvell 88NV1160 at Glance
Compute Cores Two ARM Cortex-R5
Host Interface PCIe 3.0 x2
Protocol of Host Interface AHCI, NVMe 1.3
Supported NAND Flash Types 15 nm TLC
3D TLC
3D QLC
Supported NAND Flash Interfaces Toggle 2.0 and ONFi 3.0, up to 400 MT/s
Page Sizes Unknown
Number of NAND Channels 4 channels with 4 CE per channel (16 targets in total)
ECC Technology LDPC (third-generation LDPC ECC by Marvell)
Maximum SSD Capacity 1024 GB (when using 3D QLC ICs with 512 Gb capacity)
Maximum Sequential Read Speed 1600 MB/s
Maximum Sequential Write Speed Unknown, depends on exact type of memory
Power Management Low power management (L1.2) design
Package 9 × 10 mm TFBGA package
Voltages 3.3V/1.8V/1.2V power supply (according to M.2 specs)

The 88NV1160 controller is specifically tailored for upcoming affordable SSDs, which is why it does not officially support SLC and 2D MLC NAND. Maximum capacity of a 3D QLC-based SSD featuring the 88NV1160 controller is expected to be around 1 TB, which should be enough for entry-level SSDs (as well as solid-state storage solutions for premium tablets, ultrabooks and other types of computing devices). As for performance, Marvell mentioned 1600 MB/s maximum read speed for such SSDs.

The new chip from Marvell is made using 28 nm process technology and is shipped in 9 × 10 mm TFBGA package, which can be used to build SSDs in BGA (M.2-1620 and smaller) packages as well as drives in M.2-2230/2242 form-factors. The 88NV1160 controller uses 3.3V/1.8V/1.2V power supply, in accordance with the M.2 standards.

The 88NV1160 is not the first controller from Marvell that does not require any external DRAM buffers. The company also offers low-cost 88NV1120 with SATA interface as well as 88NV1140 for PCIe 3.0 x1 SSDs. All of the aforementioned controllers are based on two ARM Cortex-R5 cores, feature Marvell’s third-gen LDPC implementation and support modern types of NAND flash memory (15nm 2D TLC and 3D TLC/QLC). However, the new 88NV1160 is the newest DRAM-less controller from the company, which is designed for rather advanced SSDs with up to 1600 MB/s read speed. Still, the 88NV1160 is clearly a solution for affordable drives because unlike the high-end 88SS1093 (or its less advanced brother, the 88SS1094) it does not support 2D MLC and SLC NAND flash and cannot take advantage of eight NAND channels (which is why it does not need PCIe 3.0 x4).

Comparison of Modern SSD Controllers from Marvell
  88NV1120 88NV1140 88NV1160 88SS1093
Compute Cores Two ARM Cortex-R5 Three cores
Host Interface SATA PCIe 3.0 x1 PCIe 3.0 x2 PCIe 3.0 x4
Protocol of Host Interface AHCI AHCI, NVMe 1.3 NVMe 1.1
Supported NAND Flash Types 15 nm TLC
3D TLC
3D QLC
15 nm SLC/MLC/TLC
3D NAND
Number of NAND Channels 2 channels
4 CE per channel (8 targets in total)
4 channels
4 CE per channel (16 targets in total)
8 channels
4 CE per channel (32 targets in total)
ECC Technology Marvell’s third-gen LDPC-based ECC technology
Host Memory Buffer No Yes Yes
Package 8 × 8 mm
TFBGA
9 × 10 mm
TFBGA
BGA
Compatibility M.2/BGA SSDs M.2/2.5″ SSDs

The developer did not reveal when it expects the first SSDs based on the 88NV1160 controller to hit the market, but it indicated that the chip is available for sampling globally. In addition, the company indicated that it offers turnkey firmware to its customers so to enable faster time to market.