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MSI Rolls-Out CUBI 2 Plus SFF PCs Featuring Intel’s Mini-STX Platform

MSI Rolls-Out CUBI 2 Plus SFF PCs Featuring Intel’s Mini-STX Platform

MSI this week introduced its all-new CUBI 2 Plus and CUBI 2 Plus vPro miniature personal computers based on Intel’s mini-STX motherboard form-factor. The new PCs are slightly larger than Intel’s own NUC systems, but they support CPU upgrades and are generally more powerful.

It is not a secret that sales of mainstream desktop computers are stagnating or even declining these days. However, there are two types of desktops, which popularity is actually growing: gaming PCs as well as small form-factor (SFF) systems. To further stimulate demand for miniature computers, Intel in the recent years introduced a number of all-new small form-factors, hoping to improve sales of its microprocessors. Last year the world’s largest maker of CPUs introduced three new types of mini PC designs: Compute Stick, Mini Lake and 5” × 5”. The first two are fully-integrated platforms that cannot be upgraded, they should be produced completely by PC makers or OEMs, which greatly lowers their design flexibility, something that is important for numerous resellers. By contrast, the 5” × 5” platform (which Intel calls mini-STX) features a CPU socket, two SO-DIMM slots, one or two M.2 slots, SATA connectors as well as various I/O ports. For many resellers, the mini-STX platforms should be more preferable than Intel’s NUC because they allow installing different processors, depending on requirements, as well as use inexpensive standard coolers.

MSI is one of the first companies to offer SFF PCs featuring mini-STX form-factor motherboards. The MSI CUBI 2 Plus based on the Intel H110 platform controller hub (PCH) will target mainstream users, whereas the MSI CUBI 2 Plus vPro featuring the Intel Q170 PCH are designed for business and enterprise customers, who will take advantage of Intel’s latest-generation vPro technology with Intel Authenticate feature. The systems can be powered by Intel’s Core i3-6100T, Core i5-6500T or Core i7-6700T processors with 35W TDP and integrated graphics. The systems feature two SO-DIMM slots for up to 32 GB of DDR4-2133 memory, one M.2 slot for a Wi-Fi module, one M.2 for an SSD as well as one SATA port for storage devices.

MSI CUBI 2 Plus Specifications
  CUBI 2 Plus CUBI 2 Plus vPro
CPU Intel Core i3-6100T (2 cores, 3.20 GHz, 3 MB LLC)
Intel Core i5-6500T (4 cores, 2.5 GHz/3.10 GHz, 6 MB LLC)
Intel Core i7-6700T (4 cores with HT, 2.8 GHz/3.6 GHz, 8 MB LLC)
PCH Intel H110 Intel Q170
Graphics Intel HD Graphics 530 with 24 execution units
Memory Two SO-DIMM slots, up to 32 GB of DDR4-2133
Storage One M.2 slot for SSDs
One SATA connector for 2.5″ SSD or HDD
Wi-Fi 802.11ac + BT 4.0 or 802.11b/g/n
Ethernet Gigabit Ethernet with RJ45 connector
Display Outputs 1 HDMI,
1 DisplayPort
Audio TRRS connector for headset with microphone
USB 1 USB 3.0 type-C (5 Gbps),
2 USB 3.0 type-A (5 Gbps),
4 USB 2.0 (including one with charging capabilities)
Other I/O SD card reader
Dimensions 155.3 x 147.9 x 58.6 (mm)
PSU External, 90 W

I/O capabilities of the MSI CUBI 2 Plus PCs are pretty rich: one USB 3.0 type-C (5 Gbps), two USB 3.0 type-A, four USB 2.0 (including one with charging capabilities), one DisplayPort, one HDMI, one Gigabit Ethernet connector. In addition, the system is equipped with one TRRS mini-jack and an SD card reader.

Both versions of the MSI CUBI 2 Plus will use Microsoft Windows 10 Home operating system, which is somewhat strange, given positioning of the version featuring Intel’s vPro technology.

It is interesting to note that at present Intel does not offer Skylake-S CPUs with higher-end integrated graphics. The highest-performing integrated GPU inside Intel’s socketed desktop chips is the HD Graphics 530 with 24 execution units (EUs). Meanwhile, Intel already offers its NUC systems with its Core i7-5557U CPU featuring the Iris 6100 graphics (48 EUs) or the Core i5-6260U with the Iris 540 graphics (48 EUs, 64 MB eDRAM). While such CPUs will offer lower general-purpose performance compared to Intel’s socketed Skylake processors because of lower number of cores and lower clock-rates, their performance in graphics-intensive workloads will be higher. Moreover, Intel also offers mobile CPUs with the Iris Pro 580 graphics (72 EUs, 128 MB eDRAM), which can be integrated into NUCs and rival current-gen Skylake-S chips in all types of workloads. As it turns out, at present it is impossible to get a mini-STX system with proper integrated graphics, which means that if you want to get maximum graphics performance out of an SFF PC, you should wait for Intel’s Skull Canyon NUC. While small form-factor systems are not expected to run demanding games, it does not hurt to have a performance headroom.

Exact prices of the MSI CUBI 2 Plus SFF systems will depend on their actual configurations.

Hands-On With the Xiaomi Mi5 – High-End at a Mid-Range Price

It’s been over 18 months since Xiaomi announced the Mi 4 back in June 2014, and today the company is finally ready to release the predecessor in the form of the Mi 5. The western launch here in Barcelona was presented by VP of Global, Hugo Barra and we were lucky enough to have the opportunity to live-blog the event and get a more in-depth hands-on later in the day. The Mi 5 is Xiaomi’s 5”-range form-factor flagship device and will be one of the main devices competing for buyer’s attention this generation.

In a fashion that is very popular with Chinese vendors, Xiaomi was eager to talk about the detailed specifications of the Mi 5 during its presentation, so without much ado, let’s go hands-on with Xiaomi’s latest phone.:

AMD Releases Radeon Software Crimson 16.2 Drivers

AMD Releases Radeon Software Crimson 16.2 Drivers

It didn’t take long at all, but AMD has come in with another driver update full of performance enhancements, compatibility fixes, and bug fixes. With continued efforts on their latest commitment to improve their drivers let’s look at what Crimson 16.2 bring to the table.

This release continues what has become a steady flow of bugfixes. From AMD solving general stability issues such as TDR errors found when running a system with Intel and AMD Graphics to an HDMI monitor, to multiple fixes from Fallout 4 relating to graphics glitches and edge cases found with AMD Crossfire and AMD Freesync. The recently released Rise of the Tomb Raider has also received some attention to fix both visual glitches and a crash that occurs when running very high settings and SMAA at 4K.

This latest driver also brings performance and quality improvements for Rise of the Tomb Raider and a report of the Radeon R9 390, Nano, and Fury series cards receiving VR Recommended status in Valves new SteamVR Performance Test. But what AMD draws the most attention to is Radeon Software Crimson Edition 16.2 being optimized for Yesterdays release of Stardock’s Ashes of the Singularity – Benchmark 2, of which we gave a thorough running as well.

As always, those interested in reading more or installing the updated hotfix drivers for AMD’s desktop, mobile, and integrated GPUs can find them either under the driver update section in Radeon Settings or on AMDs Radeon Software Crimson Edition download page.

Intel Announces XMM7480 LTE Modem: 4x DL CA, 256QAM

Intel Announces XMM7480 LTE Modem: 4x DL CA, 256QAM

At MWC 2016, Intel announced their latest modem, the XMM7480. While to some extent Intel’s cadence isn’t quite as aggressive as others in the modem space, Intel’s modems are still a relevant part of the modem ecosystem.

At a high …

Samsung Announces 256GB UFS Embedded Storage Solution

Samsung Announces 256GB UFS Embedded Storage Solution

Interestingly enough, we’re seeing something of a division in the mobile storage space, as it seems that some OEMs are focusing their efforts on UFS for internal storage, while others are moving towards NVMe over mobile PCI-E. Samsung Electronics seems to be staying with UFS for now, and recently announced their next generation of UFS 2.0 embedded storage solutions, which use 3D V-NAND to enable better NAND storage characteristics and to bump up the capacity from 128GB to 256GB.

By moving to V-NAND, random reads and writes are now at 45k and 40k IOPS, or 176 and 156 MB/s with 4KB blocks, which is well over double what shipped in the Galaxy S6. For sequential reads, speeds top out as high as 850 MB/s which is even faster than the 520 MB/s maximum of some SATA SSDs. Given that this is likely to be Samsung’s 30nm V-NAND process, I suspect that the storage density needed to achieve this kind of performance involves some sort of SLC/TLC hybrid, but in the absence of more information it’s hard to say.

While the new NAND definitely is part of the speed improvement, it couldn’t have been achieved without an increase of the interface bandwidth. The new memory today is the first announced UFS 2.0 solution based on a 2-lane interface. The UFS 2.0 standard defines a lane running at up to HS Gear 3 at up to 600MB/s, so doubling up of the lanes gives a theoretical maximum of 1.2GB/s. It’ll definitely be interesting to see what devices adopt this storage solution in the near future.