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Intel Details PowerVia Chipmaking Tech: Backside Power Performing Well, On Schedule For 2024

At next week’s annual VLSI Symposium, Intel will be presenting a trio of highly-anticipated papers about their progress with their upcoming PowerVia chip fabrication technology – the company’s in-development implementation of backside power delivery networks. Along with Intel’s RibbonFET technology for gate-all-around transistors, PowerVia and RibbonFET are slated to serve as Intel’s big one-two punch […]

TeamGroup Announces T-Force Xtreem ARGB DDR5 Memory: Up to DDR5-8266
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TeamGroup Announces T-Force Xtreem ARGB DDR5 Memory: Up to DDR5-8266

At Computex 2023, TeamGroup unveiled two additions to its extensive family of memory products. Available with ARGB heatsinks or subtle black non-RGB heatsinks, the TeamGroup T-Force Xtreem DDR5 memory promises high performance for memory overclockers and gamers. Looking to rival the high-speed DDR5 kits from companies such as G.Skill, the T-Force Xtreem DDR5 memory is available up […]

Next-Generation CAMM, MR-DIMM Memory Modules Show Up at Computex
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Next-Generation CAMM, MR-DIMM Memory Modules Show Up at Computex

Dynamic random access memory is an indispensable part of all computers, and requirements for DRAM — such as performance, power, density, and physical implementation — tend to change now and then. In the coming years, we will see new types of memory modules for laptops and servers as traditional SO-DIMMs and RDIMMs/LRDIMMs seem to run […]

ASRock Unveils Z790 and B650E Taichi Lite Motherboards: Taichi Goes Lite
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ASRock Unveils Z790 and B650E Taichi Lite Motherboards: Taichi Goes Lite

At Computex 2023 in Taipei, Taiwan, ASRock unveiled two motherboards based on its popular and long-running Taichi series, but with a slight twist. Designed to offer an alternative to their flagship Taichi series, the Z790 Taichi Lite and B650E Taichi Lite, as the model naming suggests, are lighter versions of their premium models. Still maintaining […]

Meta Reveals Quest 3 VR Headset: Higher Resolutions and Next-Gen Snapdragon SoC
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Meta Reveals Quest 3 VR Headset: Higher Resolutions and Next-Gen Snapdragon SoC

Meta on Thursday announced the Quest 3, its next generation all-in-one untethered VR/MR headset. The updated headset is based around a newer Qualcomm SoC for VR/MR applications, offering increased performance, a higher resolution display, improved controllers, an all-new 6-degree-of-freedom (6DoF) positional tracking system, and backwards compatibility with existing software developed for existing the Quest headset. […]