News


Intel Discloses New Details On Meteor Lake VPU Block, Lays Out Vision For Client AI

While the first systems based on Intel’s forthcoming Meteor Lake (14th Gen Core) systems are still at least a few months out – and thus just a bit too far out to show off at Computex – Intel is already laying the groundwork for Meteor Lake’s forthcoming launch. For this year’s show, in what’s very […]

NVIDIA: Grace Hopper Has Entered Full Production & Announcing DGX GH200 AI Supercomputer

NVIDIA: Grace Hopper Has Entered Full Production & Announcing DGX GH200 AI Supercomputer

Teeing off an AI-heavy slate of announcements for NVIDIA, the company has confirmed that their Grace Hopper “superchip” has entered full production. The combination of a Grace CPU and Hopper H100 GPU, Grace Hopper is designed to be NVIDIA’s answer for customers who need a more tightly integrated CPU + GPU solution for their workloads […]

Arm Unveils 2023 Mobile CPU Core Designs: Cortex-X4, A720, and A520 – the Armv9.2 Family

Throughout the world, if there’s one universal constant in the smartphone and mobile device market, it’s Arm. Whether it’s mobile chip makers basing their SoCs on Arm’s fully synthesized CPU cores, or just relying on the Arm ISA and designing their own chips, at the end of the day, Arm underlies virtually all of it. […]

TSMC Preps 6x Reticle Size Super Carrier Interposer for Extreme SiP Processors

TSMC Preps 6x Reticle Size Super Carrier Interposer for Extreme SiP Processors

As part of their efforts to push the boundaries on the largest manufacturable chip sizes, Taiwan Semiconductor Manufacturing Co. is working on its new Chip-On-Wafer-On-Substrate-L (CoWoS-L) packaging technology that will allow it to build larger Super Carrier interposers. Aimed at the 2025 time span, the next generation of TSMC’s CoWoS technology will allow for interposers reaching up […]

TSMC Details N4X Process for HPC: Extreme Performance at Minimum Leakage

TSMC Details N4X Process for HPC: Extreme Performance at Minimum Leakage

At its 2023 Technology Symposium TSMC revealed some additional details about its upcoming N4X technology that is designed specifically for high-performance computing (HPC) applications. This node promises to enable ultra-high performance and improve efficiency while maintaining IP compatibility with N4P (4 nm-class) process technology. “N4X truly sets a new benchmark for how we can push […]