Intel Outs Z390 & X399 PCHs for Cannon Lake & Coffee Lake CPUs

Intel this week released its new Rapid Storage Technologies drivers, and thanks to their associated release notes, Intel has indirectly confirmed their upcoming Z390 and X399 PCHs. The drivers’ release notes also shed some light on Intel’s 9^th Generation Core processors as well as features of Intel’s future HEDT platform.

Intel’s new and upcoming platforms for desktops and workstations rely on the company’s Cannon Point-H (CNP-H) PCH silicon in various configurations and with various differentiators, according to release notes for the Intel RST version 16.0 driver. The CNP-H chip itself is already in high volume production and is sold to PC makers under the CM246, HM370, QM370, H370, H310, Q370, and B360 SKUs. Said chipsets power high-performance laptops based on mobile Coffee Lake processors as well as new motherboards for consumer and corporate desktops. Going forward, Intel’s Cannon Point-H PCH will also be used for various desktops (under the Z390, H310, H370, Q370, Q360, B360 model numbers), workstations (under the C246 model number), and high-end desktops (under the X399 SKU).

It is noteworthy that the Intel X399 PCH will be validated only with the Skylake-X CPUs (at least initially), leaving the unusual Kaby Lake-X family notably absent. It remains to be seen whether Intel plans to rebrand Skylake-X processors for the X399 platform in a bid to emphasize possible new features of the platform, but typically the company does not do anything like this in the HEDT segment.

Intel’s upcoming low-power laptop platforms running the 9^th Generation Core “Cannon Lake-U” SoCs will use a different PCH known as the Cannon Point-LP. The document does not say anything about usage of non-Cannon Lake silicon in the 9^th Gen Core family for low-power notebooks, so it looks like the said platforms will rely solely on Intel’s CPUs made using its 10 nm process technology. At the same time, it is also noteworthy that Intel does not list any Cannon Lake-Y SoCs in the release notes, so the destiny of such products remains unknown.

Since release notes for the drivers are not meant to announce precise product specifications, it is impossible to say what exactly to expect from the Z390 or the X399 PCHs. Meanwhile, general specs of the Q370, H370 SKUs and other PCHs based on the CNP-H silicon are well known, so the base functionality of the upcoming chipsets is more or less obvious

Intel does not comment on unreleased products, so we cannot get you any official information at this point.

Related Reading:

• Intel’s 10nm Briefly Appears: Dual Core Cannon Lake in Official Documents
• Intel Documents Point to AVX-512 Support for Cannon Lake Consumer CPUs
• Intel Officially Reveals Post-8th Generation Core Architecture Code Name: Ice Lake, Built on 10nm+
• Intel 8th Generation and 9th Generation Processor Lists Leaked: Coffee Lake Refresh?

CPU Design Guru Jim Keller Joins Intel; Completes CPU Grand Tour

For long-time AnandTech readers, Jim Keller is a name many are familiar with. The prolific microarchitectural engineer has been involved in a number of high-profile CPU & SoC projects over the years, including AMD’s K8 and Zen CPUs and Apple’s early A-series SoCs. Now after a stint over as Tesla for the past couple of years, Intel has announced that they have hired Keller to lead their silicon engineering efforts.

After rumors on the matter overnight, in a press release that has gone out this morning, Intel confirmed that they have hired Jim Keller as a Senior Vice President. There, Keller will be heading up the 800lb gorilla’s silicon engineering group, with an emphasis on SoC development and integration. Beyond this, Intel’s press release is somewhat cryptic – especially as they tend not to be very forward about future processor developments. But it’s interesting to note that in a prepared statement included with the press release, Dr. Murthy Renduchintala – Intel’s Chief Engineering Officer – said that the company has “embarked on exciting initiatives to fundamentally change the way we build the silicon as we enter the world of heterogeneous process and architectures,” which may been seen as a hint of Intel’s future direction.

What is known for sure is that for most of the last decade, Keller’s engineering focus has been on low-power hardware. This includes not only his most recent stint at Tesla working on low voltage hardware, but also his time at Apple and PA Semiconductor developing Apple’s mobile SoCs, and even AMD’s Zen architecture is arguably a case of creating an efficient, low-power architecture that can also scale up to server CPU needs. So Keller’s experience would mesh well with any future development plans Intel has for developing low-power/high-efficiency hardware. Especially as even if Intel gets its fab development program fully back on track, there’s little reason to believe they’re going to be able to duplicate the manufacturing-derived performance gains they’ve reaped over the past decade.

As for any specific impact Keller might have on Intel’s efforts, that is a curiosity that remains to be seen. Keller’s credentials are second to none – he’s overseen a number of pivotal products – but it bears mentioning that modern processor engineering teams are massive groups working on development cycles that span nearly half a decade. A single rock star engineer may or may not be able to greatly influence an architecture, but at the same time I have to imagine that Intel has tapped Keller more for his leadership experience at this point. Especially as a company the size of Intel already has a number of good engineers at their disposal, and unlike Keller’s second run at AMD, the company isn’t recovering from a period of underfunding or trying to catch up to a market leader. In other words, I don’t expect that Intel is planning on a moment of Zen for Keller and his team.

One of Jim Keller’s Many Children: AMD’s Raven Ridge APU

Though with his shift to Intel, it’s interesting to note that Jim Keller has completed a de facto grand tour of the high performance consumer CPU world. In the last decade he’s worked for Apple, AMD, and now Intel, who are the three firms making the kind of modern ultra-wide high IPC CPU cores that we see topping our performance charts. Suffice it to say, there are very high-profile engineers of this caliber that these kind of companies will so openly court and/or attempt to pull away from the competition.

For those keeping count, this also marks the second high-profile architect from AMD to end up at Intel in the last 6 months. Towards the end of last year Intel picked up Raja Koduri to serve as their chief architect leading up their discrete GPU development efforts, and now Jim Keller is joining in a similar capacity (and identical SVP title) for Intel’s silicon engineering. Coincidentally, both Kodrui and Keller also worked at Apple for a time before moving to AMD, so while they haven’t been on identical paths – or even working on the same products – Keller’s move to Intel isn’t wholly surprising considering the two never seem to be apart for too long. So it will be exciting to see what Intel is doing with their engineering acquisitions over the coming years.