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Alphacool Releases Two New SSD Coolers: Passive HDX-2 and Watercooled HDX-3

Alphacool Releases Two New SSD Coolers: Passive HDX-2 and Watercooled HDX-3

This week Alphacool announced the availability of their new M.2 SSD Coolers, the HDX-2 and HDX-3. Some may recall the original HDX M.2 cooler was a simple, passive, clip on heatsink for M.2 SSDs, and was designed to help prevent thermal throttling which has a tendency to plague synthetic test results on some M.2 based drives. With the advent of the HDX-2 and HDX-3, they have moved beyond the simple clip cooler and to using a PCIe x4 card. This design change allowed a full sized heatsink to be mounted on it giving more surface area to cool the attached M.2 device. The HDX-3 takes the HDX-2 and its passive setup a step further and uses a waterblock instead of the large heatsink to remove the heat created from these SSDs.

 

The dimensions both the of HDX-2 come in at 100 x 81.5 x 20 mm with the HDX-3 being slightly taller at 120 mm while sharing the same width and height. According to Alphacool, the included 4x PCIe card allows a maximum bandwidth of around 3900 MB/s. Existing M.2 drives on the market will not be able to saturate it. Though it is double sided, both M.2 coolers hold one M.2 based device. Contact from the M.2 device to the heatsink is provided by included thermal pads. These thermals pads cover both single and double sided M.2 drives. The HDX-2 and HDX-3 both support up to one 80mm M.2 SSD. Both devices connect to the PCIe slot and mount to the case for a stable platform. 

Alphacool HDX-2 and HDX-3 M.2 SSD Coolers
Technical Data HDX-2 HDX-3
Dimensions (LxWxH) 100 x 81.5 x 20 mm 120 x 81.5 x 20 mm
Material Aluminum Copper, Acetal
Threads N/A 2x G 1/4″
PCIe Form Factor PCIe 3.0 x4
Compatibility M.2 2280 PCIe SSDs
Max. Bandwidth PCIe Card 3938 MB/s

The HDX-2 uses large aluminum heatsinks on both sides of the included PCIe card easily covering the M.2 drive it aims to cool. The heatsinks are black with αCOOL and HDX-2 stenciled on it in white as well as having cooling fins to increase cooling area – the heatsinks cover the entire PCB of the PCIe card. The drive is mounted to the PCB, thermal pads applied to the drive, then mount the heatsink to the board. 

The HDX-3 block is made of nickel-plated copper with the top made from a single piece of acetal. The block mounts to one side of the PCIe card leaving the other side open. Alphacool says water flows over the entire SSD to help keep things cool. The water enters and exits the block at the opposite end to the PCIe connector using standard G ¼” a threads. 

Pricing and availability were not listed in the press release. 

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Intel Launches Movidius Neural Compute Stick: Deep Learning and AI on a $79 USB Stick

Intel Launches Movidius Neural Compute Stick: Deep Learning and AI on a $79 USB Stick

Today Intel subsidiary Movidius is launching their Neural Compute Stick (NCS), a version of which was showcased earlier this year at CES 2017. The Movidius NCS adds to Intel’s deep learning and AI development portfolio, building off of Movidius’ April 2016 launch of the Fathom NCS and Intel’s later acquisition of Movidius itself in September 2016. As Intel states, the Movidius NCS is “the world’s first self-contained AI accelerator in a USB format,” and is designed to allow host devices to process deep neural networks natively – or in other words, at the edge. In turn, this provides developers and researchers with a low power and low cost method to develop and optimize various offline AI applications.

Movidius’s NCS is powered by their Myriad 2 vision processing unit (VPU), and, according to the company, can reach over 100 GFLOPs of performance within an nominal 1W of power consumption. Under the hood, the Movidius NCS works by translating a standard, trained Caffe-based convolutional neural network (CNN) into an embedded neural network that then runs on the VPU. In production workloads, the NCS can be used as a discrete accelerator for speeding up or offloading neural network tasks. Otherwise for development workloads, the company offers several developer-centric features, including layer-by-layer neural networks metrics to allow developers to analyze and optimize performance and power, and validation scripts to allow developers to compare the output of the NCS against the original PC model in order to ensure the accuracy of the NCS’s model.

The 2017 Movidius NCS vs. 2016 Fathom NCS

According to Gary Brown, VP of Marketing at Movidius, this ‘Acceleration mode’ is one of several features that differentiate the Movidius NCS from the Fathom NCS. The Movidius NCS also comes with a new “Multi-Stick mode” that allows multiple sticks in one host to work in conjunction in offloading work from the CPU. For multiple stick configurations, Movidius claims that they have confirmed linear performance increases up to 4 sticks in lab tests, and are currently validating 6 and 8 stick configurations. Importantly, the company believes that there is no theoretical maximum, and they expect that they can achieve similar linear behavior for more devices. Though ultimately scalability will depend at least somewhat with the neural network itself, and developers trying to use the feature will want to play around with it to determine how well they can reasonably scale.

Meanwhile, the on-chip memory has increased from 1 GB on the Fathom NCS to 4 GB LPDDR3 on the Movidius NCS, in order to facilitate larger and denser neural networks. And to cap it all off, Movidius has been able to reduce the MSRP to $79 – citing Intel’s “manufacturing and design expertise” – lowering the cost of entry even more.

Like other players in the edge inference market, Movidius is looking to promote and capitalize on the need for low-power but capable inference processors for stand-alone devices. That means targeting use cases where the latency of going to a server would be too great, a high-performance CPU too power hungry, or where privacy is a greater concern. In which case, the NCS and the underlying Myriad 2 VPU are Intel’s primary products for device manufacturers and software developers.

Movidius Neural Compute Stick Products
  Movidius Neural Compute Stick Fathom Neural Compute Stick
Interface USB 3.0 Type A USB 3
On-chip Memory 4Gb LPDDR3 1Gb/512Mb LPDDR3
Deep Learning Framework Support Caffe Caffe
TensorFlow
Native Precision Support FP16 FP16, 8bit
Features Acceleration mode
Multi-Stick mode
N/A
Nominal Power Envelope 1W 1W
SoC Myriad 2 VPU Myriad 2 VPU (MA2450)
Launch Date 7/20/2017 4/28/2016
MSRP $79 $99

As for the older Fathom NCS, the company notes that the Fathom NCS was only ever released in a private beta (which was free of charge). So the Movidius NCS is the de facto production version. For customers who did grab a Fathom NCS, Movidius says that Fathom developers will be able to retain their current hardware and software builds, but the company will be encouraging developers to switch over to the production-ready Movidius NCS.

Stepping back, it’s clear that the Movidius NCS offers stronger and more versatile features beyond the functions described in the original Fathom announcement. As it stands, the Movidius NCS offers native FP16 precision, with over 10 inferences per second at FP16 precision on GoogleNet in single-inference mode, putting it in the same range as the 15 nominal inferences per second of the Fathom. While the Fathom NCS was backwards compatible with USB 1.1 and USB 2, it was noted that the decreased bandwidth reduced performance; presumably, this applies for the Movidius NCS as well.

SoC-wise, while the older Fathom NCS had a Myriad 2 MA2450 variant, a specific Myriad 2 model was not described for the Movidius NCS. A pre-acquisition 2016 VPU product brief outlines 4 Myriad 2 family SoCs to be built on a 28nm HPC process, with the MA2450 supporting 4Gb LPDDR3 while the MA2455 supports 4Gb LPDDR3 and secure boot. Intel’s own Myriad 2 VPU Fact Sheet confirms the 28nm HPC process, implying that the VPU remains fabbed with TSMC. Given that the 2014 Myriad 2 platform specified a TSMC 28nm HPM process, as well as a smaller 5mm x 5mm package configuration, it’s possible that a different, more refined 28nm VPU powers the Movidius NCS. In any case, it was mentioned that the 1W power envelope applies to the Myriad 2 VPU, and that in certain complex cases, the NCS may operate within a 2.5W power envelope.

Ecosystem Transition: From Google’s Project Tango to Movidius, an Intel Company

Close followers of Movidius and the Myriad SoC family may recall Movidius’ previous close ties with Google, having announced a partnership with Myriad 1 in 2014, culminating in the Myriad 1’s appearance in Project Tango. Further agreements in January 2016 saw Google sourcing Myriad processors and Movidius’ entire software development environment in return for Google contributions to Movidius’ neural network technology roadmap. In the same vein, the original Fathom NCS also supported Google’s TensorFlow, in contrast to the Movidius NCS, which is only launching with Caffe support.

As an Intel subsidiary, Movidius has unsurprisingly shifted into Intel’s greater deep learning and AI ecosystem. On that matter, Intel’s acquisition announcement explicitly linked Movidius with Intel RealSense (which also found its way into Project Tango) and computer vision endeavors; though explicit Movidius integration with RealSense is yet to be seen – or if in the works, made public. In the official Movidius NCS news brief, Intel does describe Movidius fitting into Intel’s portfolio as an inference device, while training and optimizing neural networks falls to the Nervana cloud and Intel’s new Xeon Scalable processors respectively. To be clear, this doesn’t preclude Movidius NCS compatibility with other devices, and to that effect Mr. Brown commented: “If the network has been described in Caffe with the supported layer types, then we expect compatibility, but we also want to make clear that NCS is agnostic to how and where the network was trained.”

On a more concrete note, Movidius has a working demonstration of a Xeon/Nervana/Caffe/NCS workflow, where an end-to-end workflow of a Xeon-based training scheme generates a Caffe network optimized by Nervana’s Intel Caffe format, which is then deployed via NCS. Movidius plans to debut this demo at Computer Vision and Pattern Recognition (CVPR) conference in Honolulu, Hawaii later this week. In general, Movidius and Intel promise to have plenty to talk about in the future, where Mr. Brown comments: “We will have more to share about technical integrations later on, but we are actively pursuing the best end-to-end experience for training through to deployment of deep neural networks.”

Upcoming News and NCS Demos at CVPR

Alongside the Xeon/Caffe/Nervana/NCS workflow demo, Movidius has a slew of other things to showcase at CVPR 2017. Interestingly, Intel has described their presentations and demos as two separate Movidius and RealSense affairs, implying that the aforementioned Movidius/RealSense unification is still in the works.

For Movidius, Intel describes three demonstrations: “SDK Tools in Action,” “Multi-Stick Neural Network Scaling,” and “Multi-Stage Multi-Task Convolutional Neural Network (MTCNN).” The first revolves around the Movidius Neural Compute SDK and the platform API. The multi-stick demo showcases 4 Movidius NCS’ in accelerating object recognition. Finally, the third demo showcases Movidius NCS support for MTCNN, “a complex multi-stage neural network for facial recognition.” Meanwhile, Intel is introducing the RealSense D400 series, a depth-sensing camera family

The multi-stick demo is presumably what the company mentioned as a multi-stick demo that has been validated on three different host platforms: desktop CPU, laptop CPU, and a low-end SoC. The company also has a separate acceleration demo, where the Movidius NCS accelerates a Euclid developer module and offloads the CPUs, “freeing up the CPU for other tasks such as route planning or running application-level tasks.” The result is around double the framerate and a two-thirds power reduction.

All-in-all, Intel sees and outright states that they consider the Movidius NCS to be a means towards democratizing deep learning application development. As recent as this week, we’ve seen a similar approach as Intel’s recent 15.46 integrated graphics driver brought support for CV and AI workload acceleration on Intel integrated GPUs, tying in with Intel’s open source Compute Library for Deep Neural Networks (clDNN) and associated Computer Vision SDK and Deep Learning Deployment Toolkits. On a wider scale, Intel has already publicly positioned itself for deep learning in edge devices by way of their ubiquitous iGPUs, and Intel’s ambitions are highlighted by its recent history of machine learning and autonomous automotive oriented acquisitions: MobilEye, Movidius, Nervana, Yogitech, and Saffron.

As Intel pushes forward with machine learning development by way of edge devices, it will be very interesting to see how their burgeoning ecosystem coalesces. Like the original Fathom, the Movidius NCS is aimed at lowering the barriers to entry, and as the Fathom launch video supposes, a future where drones, surveillance cameras, robots, and any device can be made smart by “adding a visual cortex” that is the NCS.

With that said, however, technology is only half the challenge for Intel. Neural network inference at the edge is a popular subject for a number of tech companies, all of whom are jockeying for the lead position in what they consider a rapidly growing market. So while Intel has a strong hand with their technology, success here will mean that they need to be able to break into this new market in a convincing way, which is something they’ve struggled with in past SoC/mobile efforts. The fact that they already have a product stack via acquisitions may very well be the key factor here, since being late to the market has frequently been Intel’s Achilles’ heel in the past.

Wrapping things up, the Movidius NCS is now available for purchase for a MSRP of $79 through select distributors, as well as at CVPR.

EKWB Releases New RGB Monoblock for MSI X299 Motherboards

EKWB Releases New RGB Monoblock for MSI X299 Motherboards

This week, the Slovenian based liquid cooling manufacturer, EKWB (EK Water Blocks) released a new monoblock which is custom made for specific MSI X299 motherboards, and named the EK-FB MSI X299 Gaming Pro Carbon RGB Monoblock. MSI claims this solution provides up to 30% cooler VRM and CPU temperatures as measured at the back of the PCB. It has a built-in 4-pin RGB LED strip compatible with MSI’s Mystic Light software in order to customize the lighting experience.

Based on the EK-Supremacy Evo cooling engine, EK states it has a high flow design and can be used in systems running a weaker pump. The EK-FB MSI X299 Gaming Pro Carbon Monoblock directly cools Intel LGA2066 socket CPUs as well as the potentially hot running VRM area on many X299 boards. It does so with direct contact on the both the CPU and MOSFETs with liquid flowing directly over those critical parts inside the block.

Sparing little expense, the base is made out of nickel-plated electrolytic copper, with the top constructed of acrylic glass. According to MSI, the cold plate portion of the block has been redesigned to ensure it “…has better mechanical contact with the IHS…thus enabling better thermal transfer”. An example of this is the raised circle where the CPU IHS would be pressed against (see picture below). The required barbs are the common G 1/4″ type. 

The included 4-pin RGB LED strip connects to the motherboard’s 4-pin RGB LED header, or to other 3rd party 4-pin LED controllers. The LED strip cover can be removed and replaced with another compatible RGB LED strip, or flipped around for better cable management, orientation, and aesthetics. 

Though the name of this monoblock specifically mentions one specific motherboard, MSI says it is compatible with the following boards in their X299 lineup:

  • MSI X299 Gaming Pro Carbon AC
  • MSI X299 Gaming Pro Carbon
  • MSI X299 Gaming M7 ACK

The EK-FB MSI X299 Gaming Pro Carbon RGB Monoblock is available for pre-order now through the EK Webshop and its Partner Reseller Network. Pricing, including VAT, will be 119.95€. EK says shipping of the pre orders will start on Thursday, July 27th. 

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Memblaze Launches PBlaze5 SSDs: Enterprise 3D TLC, Up to 6 GB/s, 1M IOPS, 11 TB

Memblaze Launches PBlaze5 SSDs: Enterprise 3D TLC, Up to 6 GB/s, 1M IOPS, 11 TB

Memblaze has introduced its new generation of server-class NVMe SSDs for mixed and mission critical workloads. The PBlaze5 SSDs are based around Micron’s 3D eTLC memory and paired with a Microsemi Flashtec controller. The SSDs come in PCIe 3.0 x8 AIC or 2.5” U.2 form-factors, carry up to 11 TB of 3D TLC NAND, and feature sequential read performance of up to 6 GB/s as well as random read performance of up to 1M IOPS.

The Memblaze PBlaze5 700 and 900-series SSDs are based on Microsemi’s Flashtec PM8607 NVMe2016 controller that features 16 compute cores, 32 NAND flash channels, and supports everything one might expect from a contemporary SoC for server SSDs (LDPC 550 bit/4KB ECC with a 1×10-17 bit error rate, NVMe 1.2a, AES-256 PCIe 3.0 x8/PCIe 3.0 x4 dual-port, etc.) along with a host of enterprise-grade features. Memblaze further outfits the card with their own MemSpeed 3.0 as well as MemSolid 3.0 firmware-based technologies. The MemSpeed 3.0 feature better ensures consistent performance and QoS, and comes with further priority que management optimizations over the previous version. As for the MemSolid 3.0, it is a stack of reliability and security features of the PBlaze5 900-series drives, which we are going to touch upon later.

Both the 700 and 900 series drives use the same kind of memory — Micron’s 32-layer 3D eTLC NAND flash (384 Gb). Memblaze tells us that the 3D eTLC memory offers higher endurance and reliability, but it does not go beyond that.

Given the same controller and the same kind of memory, performance and power consumption numbers for the PBlaze5 700 and 900-series SSDs are close (the 900-series offers 50% higher random write performance). The 2.5″ drive form-factor PBlaze5 D700/D900 feature sequential read speeds of up to 3.2 GB/s, sequential write speeds of up to 2.4 GB/s, as well as up to 760K random read IOPS. The PCIe card-based PBlaze5 C700/C900 offer considerably higher performance numbers due to two times wider interface (PCIe 3.0 x8): sequential reads up to 6 GB/s, sequential writes up to 2.4 GB/s, and 1.042M read IOPS, respectively. As for power consumption, all the drives use from 7 to 25 W of power, depending on the configuration, workload and settings. However, the similarities between the PBlaze5 700 and 900-series SSDs end here.

The PBlaze5 700 drives are designed for datacenters that require maximum performance, high density and capacity at low power and moderate costs. That said, the PBlaze 700-series are rated for 1 DPWD for five years and come with reliability features that are consistent with other SSDs for hyperscale datacenters.

By contrast, the PBlaze5 900-series drives are aimed at mission critical environments (databases, financial transactions, analytics, etc.) that need enhanced reliability. In addition to extended error correction code (with a 1×10-17 bit error rate), the PBlaze 900-series also supports T10 Data Integrity Field (DIF)-compliant end-to-end data path protection, which results in a Silent Bit Error Rate (SBER) lower than 10-23. In addition, the 900-series takes full advantage of all MemSolid 3.0 enhancements offering features like crypto erase, background scan protection, firmware encryption (one of the first SSDs to support this feature), whole disk encryption, metadata protection, read disturb protection, dual-port capability (U.2 drives only), and so on. For those who need to precisely manage the power consumption of their SSDs, the MemSolid 3.0-based drives offer distinct 15, 20 and 25 W modes. As for endurance, Memblaze guarantees 3 DPWD over five years for its PBlaze5 900-series SSDs.

Memblaze PBlaze5 Series Specifications
  PBlaze5 D700 PBlaze5 C700 PBlaze5 D900 PBlaze5 C900
Form Factors 2.5″ U.2 Drive HHHL AIC 2.5″ U.2 Drive HHHL AIC
Interface PCIe 3.0 x4 PCIe 3.0 x8 PCIe 3.0 x4 PCIe 3.0 x8
Capacities 2 TB
3.6 TB
4 TB
8 TB
11 TB
2 TB
3.2 TB
4 TB
8 TB
Controller Microsemi Flashtec PM8607 NVMe2016
Protocol NVMe 1.2a
NAND 3D Enterprise TLC NAND memory
Sequential Read 3.2 GB/s 6 GB/s 3.2 GB/s 6 GB/s
Sequential Write 2.4 GB/s 2.4 GB/s 2.4 GB/s 2.4 GB/s
Random Read (4 KB) IOPS 760,000 1,042,000 760,000 1,042,000
Random Write (4 KB) IOPS 210,000 304,000
Latency Read 90 µs
Latency Write 15 µs
Power Idle 7 W
Operating 23 W
ECC LDPC 550 bit/4 KB
Endurance 1 DWPD 3 DWPD
Dual-Port Support +
Uncorrectable Bit Error Rate <1 bit per 10-17 bits read
Silent Bit Error <1 bit per 10-23 bits read
End-to-End Data Protection T10 DIF/DIX
Crypto Erase +
Firmware Signature +
PCIe ECRC +
Encryption AES-256
Power Loss Protection Yes
Proprietary Technologies MemSpeed 3.0 MemSpeed 3.0
MemSolid 3.0
MTBF 2.1 million hours
Warranty Five years
Additional Information Link Link

Traditionally, Memblaze does not publicly list the pricing of their enterprise SSDs, as pricing is dependent in part on the number ordered and just how the customer wants the drives configured. The company is currently working with its partners on deploying the PBlaze5 drives, and actual volume shipments will begin after their clients validate the SSDs with their respective applications.

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