Vik


Samsung Announces Second-Gen 14nm Low Power Plus (14LPP) Process Now In Mass Production

Samsung Announces Second-Gen 14nm Low Power Plus (14LPP) Process Now In Mass Production

Today Samsung Semiconductor officialy announces mass production for its second generation 14nm FinFET manufacturing node. Early last year we saw Samsung announce mass production of its first generation FinFET process that was used in the Exynos 7420 which powered last year’s flagships from Samsung Mobile and Meizu.

“We are pleased to start production of our industry-leading, 2nd generation 14nm FinFET process technology that delivers the highest level of performance and power efficiency” said Charlie Bae, Executive Vice President of Sales & Marketing, System LSI Business, Samsung Electronics. “Samsung will continue to offer derivative processes of its advanced 14nm FinFET technology to maintain our technology leadership.”

The second generation process called 14LPP (Low-Power Plus) is advertised as bringing performance as well as power improvements over the 14LPE (Low-Power Early) predecessor. The new node is described as being able to increase switching speed of up to 15% and decreasing power consumption by up to 15%.

The improvements are made possible via transistor structure changes and process optimizations, for example we see usage of a taller fin height compared to that of 14LPE. Samsung has also improved silicon straining and describes usage of fully-depleted FinFET transistors being able to bring enhanced manufacturing capabilities.

The 14LPP process is confirmed to be used in Samsung LSI’s own Exynos 8890 as well as Qualcomm’s Snapdragon 820 SoCs, which we should be seeing more of in devices coming in the next months. As GlobalFoundries licenses Samsung’s process node as we should also see CPU and GPU products from AMD produced on the new manufacturing node.

Compulab Rolls-Out Passively-Cooled Airtop Systems

Compulab Rolls-Out Passively-Cooled Airtop Systems

Compulab, a maker of miniature and small form-factor computers, is introducing its first desktop system called Airtop today. The new computer can be equipped with rather high-performance components, but is completely fanless and only uses the company’s proprietary natural air-flow (NAF) cooling technology.

Compulab’s Airtop is a compact 7.5-liter desktop system that can dissipate up to 200W of heat using only passive cooling methods. The Airtop utilizes various industry-standard components and can be configured as a gaming PC, a server or a workstation. The system is based on a proprietary motherboard featuring Intel’s C226 platform controller hub (PCH) designed specifically for the Airtop with NAF cooling. The mainboard places CPU socket, DIMM slots, PCI Express x16 slot and other components in a way to enable the most efficient dissipation of heat. To eliminate hot components from the case, the Airtop uses an external PSU with a mini-DIN connector.

The proprietary Airtop mainboard is compatible with Intel Core i7 and Intel Xeon E3 v4 microprocessors based on Intel’s Haswell or Broadwell micro-architectures (LGA1150 packaging) as well as various graphics cards, including NVIDIA’s GeForce GTX 950 and Quadro M4000.

The Airtop can be equipped with up to 32 GB of DDR3-1866 memory, four 2.5-inch Serial ATA HDDs/SSDs, one M.2 solid-state drive and one mSATA solid-state drive. The system features two Gigabit Ethernet network controllers (four more may be added using an extension card), a 802.11ac Wi-Fi card with two SIM card sockets, four SMA antennas, four USB 3.0 ports on rear panel, six USB 2.0 ports in total, three RS232 ports, multi-channel audio and so on. While the system utilizes its own mainboard, all the other components are industry-standard and can be upgraded when and if needed.

The NAF heat-exchange system uses two special side-panels, each of which can dissipate up to 100W of heat. The side-panels are equipped with traditional flat copper heat-pipe arrays (with micro-channels) that take away heat from the hottest components (i.e., the CPU and the GPU) and spread it across the side-panel. The heat from the heat-pipe arrays is removed by the special air-tube panels consisting of 14 tubes with air inside. Once the air gets hot, it starts to rise up, removing heat from the side panels (see Compulab’s video for details). Everything happens naturally (via convection) and completely silently. The air tubes are open on both ends and efficiency of convection depends on the movement of air through them. For efficient cooling, owners of Compulab’s Airtop will have to ensure that the tubes are not clogged with dust, which is common in industrial and other environments.

While Compulab’s Airtop is in many ways unique, it reminds us of Zalman’s TNN 500 and TNN 300 fanless cases released about a decade ago. Those cases were considerably bigger and acted like giant heatsinks with a lot of heat-pipes inside, but they combined the same cooling techniques as the Airtop.

Compulab claims that it took years to develop the NAF heat-exchange technology and three years to design the Airtop system. Right now, the desktop is only compatible with previous-generation Intel microprocessors and does not support modern technologies like NVMe or USB 3.1, but eventually the company could develop a more advanced motherboard for the latest-generation Skylake and the upcoming Kaby Lake chips in LGA1151 packaging.

The Airtop is relatively small, its dimensions are 10 cm (w) x 30 cm (h) x 25.5 cm (d) – 4” (w) x 12” (h) x 10” (d). The weight of the PC depends on configuration and can be between 4 and 7 kilograms.

The Compulab Airtop is available as a pre-configured system or as a barebone SFF PC for DIY enthusiasts. Since the system is unique and uses numerous components designed specifically for the Airtop, it naturally is not affordable. The Airtop barebone costs $1128, the Airtop-S passively-cooled server (featuring the Intel Xeon E3-1285L v4 CPU) starts at $1810, the Airtop-G gaming PC (with the Intel Core i7-5775C and the NVIDIA GeForce GTX 950 graphics card) is priced at $1968, whereas the Airtop-W workstation (with Intel’s Xeon E3-1285L v4 chip and NVIDIA’s Quadro M4000 graphics adapter) costs $2999. The systems will be available in Q1 2016.

Compulab Rolls-Out Passively-Cooled Airtop Systems

Compulab Rolls-Out Passively-Cooled Airtop Systems

Compulab, a maker of miniature and small form-factor computers, is introducing its first desktop system called Airtop today. The new computer can be equipped with rather high-performance components, but is completely fanless and only uses the company’s proprietary natural air-flow (NAF) cooling technology.

Compulab’s Airtop is a compact 7.5-liter desktop system that can dissipate up to 200W of heat using only passive cooling methods. The Airtop utilizes various industry-standard components and can be configured as a gaming PC, a server or a workstation. The system is based on a proprietary motherboard featuring Intel’s C226 platform controller hub (PCH) designed specifically for the Airtop with NAF cooling. The mainboard places CPU socket, DIMM slots, PCI Express x16 slot and other components in a way to enable the most efficient dissipation of heat. To eliminate hot components from the case, the Airtop uses an external PSU with a mini-DIN connector.

The proprietary Airtop mainboard is compatible with Intel Core i7 and Intel Xeon E3 v4 microprocessors based on Intel’s Haswell or Broadwell micro-architectures (LGA1150 packaging) as well as various graphics cards, including NVIDIA’s GeForce GTX 950 and Quadro M4000.

The Airtop can be equipped with up to 32 GB of DDR3-1866 memory, four 2.5-inch Serial ATA HDDs/SSDs, one M.2 solid-state drive and one mSATA solid-state drive. The system features two Gigabit Ethernet network controllers (four more may be added using an extension card), a 802.11ac Wi-Fi card with two SIM card sockets, four SMA antennas, four USB 3.0 ports on rear panel, six USB 2.0 ports in total, three RS232 ports, multi-channel audio and so on. While the system utilizes its own mainboard, all the other components are industry-standard and can be upgraded when and if needed.

The NAF heat-exchange system uses two special side-panels, each of which can dissipate up to 100W of heat. The side-panels are equipped with traditional flat copper heat-pipe arrays (with micro-channels) that take away heat from the hottest components (i.e., the CPU and the GPU) and spread it across the side-panel. The heat from the heat-pipe arrays is removed by the special air-tube panels consisting of 14 tubes with air inside. Once the air gets hot, it starts to rise up, removing heat from the side panels (see Compulab’s video for details). Everything happens naturally (via convection) and completely silently. The air tubes are open on both ends and efficiency of convection depends on the movement of air through them. For efficient cooling, owners of Compulab’s Airtop will have to ensure that the tubes are not clogged with dust, which is common in industrial and other environments.

While Compulab’s Airtop is in many ways unique, it reminds us of Zalman’s TNN 500 and TNN 300 fanless cases released about a decade ago. Those cases were considerably bigger and acted like giant heatsinks with a lot of heat-pipes inside, but they combined the same cooling techniques as the Airtop.

Compulab claims that it took years to develop the NAF heat-exchange technology and three years to design the Airtop system. Right now, the desktop is only compatible with previous-generation Intel microprocessors and does not support modern technologies like NVMe or USB 3.1, but eventually the company could develop a more advanced motherboard for the latest-generation Skylake and the upcoming Kaby Lake chips in LGA1151 packaging.

The Airtop is relatively small, its dimensions are 10 cm (w) x 30 cm (h) x 25.5 cm (d) – 4” (w) x 12” (h) x 10” (d). The weight of the PC depends on configuration and can be between 4 and 7 kilograms.

The Compulab Airtop is available as a pre-configured system or as a barebone SFF PC for DIY enthusiasts. Since the system is unique and uses numerous components designed specifically for the Airtop, it naturally is not affordable. The Airtop barebone costs $1128, the Airtop-S passively-cooled server (featuring the Intel Xeon E3-1285L v4 CPU) starts at $1810, the Airtop-G gaming PC (with the Intel Core i7-5775C and the NVIDIA GeForce GTX 950 graphics card) is priced at $1968, whereas the Airtop-W workstation (with Intel’s Xeon E3-1285L v4 chip and NVIDIA’s Quadro M4000 graphics adapter) costs $2999. The systems will be available in Q1 2016.

Conexant Announces New Audio Processing Solutions At CES

Conexant Announces New Audio Processing Solutions At CES

At CES, Conexant gave me a demo of some of the audio processing technology that they’ve been working on. Conexant is a company that probably has their technology in a product you own without you knowing it, and they focus a lot on SoCs for doing audio processing in everything from TVs, to smartphones, to IoT devices.

One of the most interesting demos shown by Conexant is of their 4 microphone voice system to provide 360 degree direction detection. The company’s CX20924 DSP enables this, and in their demo it worked quite well regardless of the angle you were at, and it even worked properly with multiple users speaking at the same time. While many devices can do this kind of detection, they often require arrays with 6-8 microphones, which can be cost prohibitive. Conexant claims that the system can work at a range of up to five meters, and it’s able to tune out background noise in order to properly interpret your voice. This system could be used to drive down the cost of voice-activated devices by reducing the amount of hardware needed, and in my mind I can think of products like the Amazon Echo being brought to lower price points without sacrificing functionality.

The second major announcement from Conexant is their CX20926 audio and sensor SoC. The chip consists of a Cortex M0+, along with Conexant’s own audio DSP for voice processing. This chip is aimed at IoT applications and other battery powered devices like smartphones where a vendor is looking to implement always-on voice detection with minimal idle power consumption.

The last announcement from Conexant is their RoomAware Optimizer sound processing for televisions. This feature has been included on LG’s 2016 OLED and QD TVs, under the name Magic Sound Tuning. The technology uses microphones to analyze the acoustic characteristics of the room in order to tune the sound produced by the TV’s speakers. While I wasn’t able to get a demo of this feature, the fact that Conexant has already gotten adoption from LG shows that there’s clearly interest in this type of tech from manufacturers and consumers.

CES 2016: MSI’s Golden Idea for Motherboards

CES 2016: MSI’s Golden Idea for Motherboards

The problem with a gold motherboard color is that it often looks too much like copper, and several companies have tried it in recent years (ASUS on Z77, ECS’ Golden Series) with limited success. Back during Z77 launch, one group of users seems t…